Monroeville, PA (412) 373-8110Murrysville, PA (724) 519-4549

MCM — Multi-Chip Modules

Chip Carriers and Multi-Chip Modules

Digital Imaging

Layers: 4
Material: High Tg FR4
Trace Width: 0.0015 +/-0.0003”
Surface Finish: Wirebondable Electrolytic Gold and Nickel

Military

Layers: 8
Materials: Thermount/Polyimide
                   (Arlon 85N)
Trace Width: 0.002 +/- 0.0003”
Stacked Microvias: L1 to L2 to L3; L8 to L7 to L6
Surface Finish: Electrolytic Gold and Nickel

Supercomputing

Layers: 8
Materials: High Tg FR4
Trace Width: 0.002 +/- 0.0003”
                        Controlled Impedance
                        (75 Ohms +/- 10%)
                        Two Tiered Cavity Design
                        Edge Plating
                        406 Buried Resistors
                        (65ohms +/- 15%; Ohmega material)
Stacked Microvias: L1 to L2 to L3; L8 to L7 to L6
Surface Finish: Electrolytic Gold and Nickel