Monroeville, PA   |   Murrysville, PA(412) 373-8110


Our engineers utilize Cadence Design Systems, Inc. layout and design tools along with Compunetics’ own in-house manufacturing and assembly resources. We use design-for-manufacture and design-for-assembly rules based on our extensive experience. This ensures that our designs are easily manufactured and assembled the first time, on schedule, and exactly to specifications.


Compunetics invites any challenging rigid, flex, and rigid flex design. Allows us to perform a full DFM / DRC review on you most challenging rigid, flex, and rigid-flex designs. Contact us for more information and support.

  • 20 + layers Rigid-flex
  • Thin and multilayer rigid, rigid-flex, and flex
  • Blind and buried lasered micro vias
  • Buried resistors and passives
  • Metal heatsinks
  • Flex stiffener
  • Epoxy filled vias
  • Mixed dielectrics
  • Edge Plating / Castellations
  • Book-bind rigid-flex
  • Loose-leaf
  • Controlled Impedance & High Speed Flex
  • Chemically milled flex circuits
  • Laser processed flex
  • Multiple flex arms
  • Inconel and constantan flex circuits and heaters
  • Exposed metal features / laser skiving
  • Ecco-Bond epoxy filleting
  • Coverlay or Flexible soldermask
  • HASL and ENIG finishes
  • Silver shielding
  • Flying leads (C02 laser ablation)
  • High speed Interconnects
  • Large format PCB size of 24” x 36”
  • UL 94V-0 Certified
  • MIL-PRF-31032
  • IPC-6012 Class 2 and Class 3
  • ITAR Rated


Using state of the art equipment including LDI, automated horizontal electroless plating, and semi-automated reverse pulse plating, we are capable of challenging via configurations including stacked vias, stepped vias, copper filled, and high aspect vias. Our capability includes thin core processing, fine line/space, and tight BGA pitches.

  • Blind and buried vias – sequential lamination
  • 1mil core processing
  • laser micro vias
  • Via-in-Pad
  • Stacked / Staggered vias
  • Copper filled microvias
  • Conductive via fill
  • Non-conductive via fill
  • Metal heatsinks
  • Cavities
  • Mixed dielectrics / hybrids
  • Edge Plating
  • Edge Castellations
  • Ormet Paste
  • BGA pitch 0.35mm
  • BGA pitch 0.50mm for 6mil drill at .060” thick
  • BGA pitch 0.56mm for 8mil drill at 0.100” thick
  • Flex stiffener
  • Epoxy filled vias
  • Coverlay or Flexible soldermask
  • HASL and ENIG finishes
  • FR406
  • 370HR
  • Polyimide
  • Dupont AP, LF, TK
  • Itera MT40
  • Tachyon
  • I-Speed
  • Teragreen 400G
  • Astra MT77
  • Taconic Materials
  • Rogers Materials
  • Nelco 4000
  • Metron 6v


Compunetics fabricates Microwave / RF / MM-Wave on a wide selections of high performance laminates. Engage in dialogue with Compunetics’ engineers who will streamline your material selection and design optimization. We are capable of intricacies like edge plates, tiered cavities, solid core, and complex via structures.

  • Large PTFE laminate selection
  • Mixed dielectrics
  • Stacked / staged lasered vias
  • Conductive and non conductive fill
  • Copper filled
  • Sequential lam
  • Heatsink
  • Metal core / solid core
  • Milled and plated cavities
  • C02 ablated cavities / features
  • Wire bondable gold soft gold / Enipig
  • Edge plating
  • Low loss, low Dk
  • Conductive adhesive (ablefilm)

Click Here for more information on our equipment.


Our design capabilities are fine-tuned to meet the most exacting standards that our customers demand of us. ESD design capabilities include, but are not limited to:

  • SMT/through-Hole
  • Military/commercial specifications
  • Controlled impedance
  • High density
  • High speed
  • High layer count (30+)
  • Analog/digital
  • Cavity construction
  • High density ball grid arrays
  • Buried resistors
  • Single/multi-chip modules
  • Blind/buried vias
  • Flex/Rigid Flex hybrids
  • Fine line (2 mil trace/space)
  • Microvias/laser drilled microvias
  • Buried capacitance
  • Net List verification
  • Mechanical interface (Pro-E/DXF)